2006-2010 [2008.05.20] Effect of Organic Amine in Colloidal Silica Slurry on Polishing-Rate Selectivity of Copper to Tantalum-nitride Film in Copper Chemical Mechanical Planarization
2021.02.27 17:31
Effect of Organic Amine in Colloidal Silica Slurry on Polishing-Rate Selectivity of Copper to Tantalum-nitride Film in Copper Chemical Mechanical Planarization
ECS Transactions