2006-2010 [2007.03.15] Effects of Abrasive Particle Size and Molecular Weight of poly(acrylic acid) in Ceria Slurry on Removal Selectivity of SiO2/Si3N4 films in Shallow Trench Isolation Chemical Mechanical Planarization
2021.02.07 20:45
Effects of Arasive Particle Size and Molecular Weight of poly(acrylic acid) in Ceria Slurry on Removal Selectivity of SiO2/Si3N4 films in Shallow Trench Isolation Chemical Mechanical Planarization
Journal of Materials Research