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Seung Yoon Lee, Tae Geun Kim, Jae Gun Park, Joo Kyoung Song, Oh Hyun Kim, Chul-Woong Yong and Jinho Ahn

 

Investigation of multilayer structural changes in phase and amplitude-defects correction process

 

J. Vac. Sci. Technol. B 23 (2005) 2866

번호 제목
147 [2006.12.14] Influence of Wafer Property on Future Semiconductor Device : Crystal Nature, Gettering, Nanotopography and Strained Silicon
146 [2006.10.15] Strained Si Engineering for Nanoscale MOSFETs file
145 [2006.10.15] Extremely Proximity Gettering for Semiconductor Devices file
144 [2006.10.03] Post-RTA Effect on electrical characteristics of Nano-scale Strained Si Grown on SiGe-on-Insulator n-MOSFET file
143 [2006.09.__] Characterization of the High Luminance Top Emission Organic Light-emitting Devices (TEOLEDs) Using Dual Cathode layer file
142 [2006.09.07] Reduction of Large Particles in Ceria Slurry by Aging and Selective Sedimentation and its Effect on Shallow Trench Isolation Chemical Mechanical Planarization file
141 [2006.08.15] Monte Carlo study of surface roughness scattering in Si inversion Layer with improved matrix element file
140 [2006.07.03] Non-volatile Memory Fabricated with Al Nanocrystals Embedded in Conductive-Low-Molecular-Organic Layers
139 [2006.06.15] Organic Bi-Stable Device Fabricated with a Sandwich Structure of Al / AIDCN / Al Nano-Crystals Surrounded by Amorphous Al2O3 / AIDCN / Al file
138 [2006.06.08] Effect of Calcination Process on Synthesis of Ceria Particles, and Its Influence on Shallow Trench Isolation Chemical Mechanical Planarization Performance file
137 [2006.05.__] Dependence of Nanotopography Impact on Fumed Silica and Ceria Slurry Added with Surfactant for Shallow Trench Isolation Chemical Mechanical Polishing file
136 [2006.05.09] Dependence of Non-Prestonian Behavior of Ceria Slurry with Anionic Surfactant on Abrasive Concentration and Size in Shallow Trench Isolation Chemical Mechanical Polishing file
135 [2006.04.__] To Build Efficient Relationship in e-Commerce by CRM
134 [2006.04.__] Study on Development Direction of Construction Industry using RFID
133 [2006.04.01] Effect of the Hydroxyl-Ethyl-Cellulose Concentration in a Silicon Wafer Polishing Slurry on the Wafer Surface Roughness file