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Chae-Woong Cho, Sang-Kyun Kim, Ungyu Paik, Jea-Gun Park and W. M. Sigmund

 

Atomic Force Microscopy Study of the Role of Molecular Weight of Poly(acrylic acid) in Chemical Mechanical Planarization for Shallow Trench Isolation

 

J. Mater. Res. 21 (2006) 473

번호 제목
147 [2006.12.14] Influence of Wafer Property on Future Semiconductor Device : Crystal Nature, Gettering, Nanotopography and Strained Silicon
146 [2006.10.15] Strained Si Engineering for Nanoscale MOSFETs file
145 [2006.10.15] Extremely Proximity Gettering for Semiconductor Devices file
144 [2006.10.03] Post-RTA Effect on electrical characteristics of Nano-scale Strained Si Grown on SiGe-on-Insulator n-MOSFET file
143 [2006.09.__] Characterization of the High Luminance Top Emission Organic Light-emitting Devices (TEOLEDs) Using Dual Cathode layer file
142 [2006.09.07] Reduction of Large Particles in Ceria Slurry by Aging and Selective Sedimentation and its Effect on Shallow Trench Isolation Chemical Mechanical Planarization file
141 [2006.08.15] Monte Carlo study of surface roughness scattering in Si inversion Layer with improved matrix element file
140 [2006.07.03] Non-volatile Memory Fabricated with Al Nanocrystals Embedded in Conductive-Low-Molecular-Organic Layers
139 [2006.06.15] Organic Bi-Stable Device Fabricated with a Sandwich Structure of Al / AIDCN / Al Nano-Crystals Surrounded by Amorphous Al2O3 / AIDCN / Al file
138 [2006.06.08] Effect of Calcination Process on Synthesis of Ceria Particles, and Its Influence on Shallow Trench Isolation Chemical Mechanical Planarization Performance file
137 [2006.05.__] Dependence of Nanotopography Impact on Fumed Silica and Ceria Slurry Added with Surfactant for Shallow Trench Isolation Chemical Mechanical Polishing file
136 [2006.05.09] Dependence of Non-Prestonian Behavior of Ceria Slurry with Anionic Surfactant on Abrasive Concentration and Size in Shallow Trench Isolation Chemical Mechanical Polishing file
135 [2006.04.__] To Build Efficient Relationship in e-Commerce by CRM
134 [2006.04.__] Study on Development Direction of Construction Industry using RFID
133 [2006.04.01] Effect of the Hydroxyl-Ethyl-Cellulose Concentration in a Silicon Wafer Polishing Slurry on the Wafer Surface Roughness file