2001-2005 [2004.11.01] Influence of physical characteristics of ceria particles on polishing rate of chemical mechanical planarization for shallow trench isolation
2019.05.02 18:15
Sang-Kyun Kim, Phil-Won Yoon, Ungyu Paik, Takeo Katoh and Jea-Gun Park
Influence of physical characteristics of ceria particles on polishing rate of chemical mechanical planarization for shallow trench isolation