메뉴 건너뛰기

 

 

Effect of the Abrasive and Additive Concentrations in Nano Ceria Slurry on CMP Pad Temperature

 

한국산학연논문집 (JOURNAL OF KASBIR)

번호 제목
102 [2004.10.28] Design and Implementation of the Mobile Disaster Management Application System Based on PDA
101 [2004.10.28] CDS Reliability Test of Contents Aggregater for VOD/NVOD Service.
100 [2004.09.__] Proximity gettering process for 300-mm silicon wafers
99 [2004.09.__] Effect of nano-scale strained Si layer grown on SiGe-on-insulator structure on MOSFET drain current improvement
98 [2004.08.__] Nature of Surface and Bulk Defects Induced by Epitaxial Layer Growth in Epitaxial Transfer Wafers file
97 [2004.08.16] A Study on the Optimization of the Layout for the ESD Protection Circuit in 0.18µm CMOS Silicide Process
96 [2004.08.15] Effect of molecular weight of surfactant in nano ceria slurry on shallow trench isolation chemical mechanical polishing (CMP) file
95 [2004.08.10] Dependency of precipitation of interstitial oxygen on its crystal nature in Czochralski silicon wafer file
94 [2004.08.01] Nanotopography impact in shallow trench isolation chemical mechanical polishing-dependence on slurry characteristics
93 [2004.08.01] Achievement of nano-scale SiGe layer with discrete Ge mole fraction profile using batch-type HVCVD
92 [2004.07.09] Nanotopography Simulation of Shallow Trench Isolation Chemical Mechanical Polishing using Nano Ceria Slurry
91 [2004.06.__] Characteristic Study for Defect of Top Si and Buried Oxide Layer on the Bonded SOI Wafer file
90 [2004.06.25] EUVL Mask Defect Isolation and Repair using Focused Ion Beam (Focused Ion Beam을 이용한 EUVL Mask Defect Isolation 및 Repair)
89 [2004.06.01] Nanotopography Impact in Shallow-Trench Isolation Chemical Mechanical Polishing - Analysis Method and Consumable Dependence file
88 [2004.05.28] EUV Lithography Blank Mask Repair using a FIB file