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U. Paik, J. P. Kim, Y. S. Jung, Y. G. Jung, T. Katoh, J. G. Park, V. A. Hackley

 

The Effect of Si Dissolution on the Stability of Silica Particles and Its Influence on Chemical Mechanical Polishing for Interlayer Dielectrics

 

J. Korean Phys. Soc. 39 (2001) S201

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