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17 |
[2006.12.14] Influence of Wafer Property on Future Semiconductor Device : Crystal Nature, Gettering, Nanotopography and Strained Silicon
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16 |
[2006.10.15] Strained Si Engineering for Nanoscale MOSFETs
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15 |
[2006.10.15] Extremely Proximity Gettering for Semiconductor Devices
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14 |
[2006.10.03] Post-RTA Effect on electrical characteristics of Nano-scale Strained Si Grown on SiGe-on-Insulator n-MOSFET
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13 |
[2006.09.__] Characterization of the High Luminance Top Emission Organic Light-emitting Devices (TEOLEDs) Using Dual Cathode layer
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12 |
[2006.09.07] Reduction of Large Particles in Ceria Slurry by Aging and Selective Sedimentation and its Effect on Shallow Trench Isolation Chemical Mechanical Planarization
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11 |
[2006.08.15] Monte Carlo study of surface roughness scattering in Si inversion Layer with improved matrix element
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10 |
[2006.07.03] Non-volatile Memory Fabricated with Al Nanocrystals Embedded in Conductive-Low-Molecular-Organic Layers
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9 |
[2006.06.15] Organic Bi-Stable Device Fabricated with a Sandwich Structure of Al / AIDCN / Al Nano-Crystals Surrounded by Amorphous Al2O3 / AIDCN / Al
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8 |
[2006.06.08] Effect of Calcination Process on Synthesis of Ceria Particles, and Its Influence on Shallow Trench Isolation Chemical Mechanical Planarization Performance
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7 |
[2006.05.__] Dependence of Nanotopography Impact on Fumed Silica and Ceria Slurry Added with Surfactant for Shallow Trench Isolation Chemical Mechanical Polishing
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6 |
[2006.05.09] Dependence of Non-Prestonian Behavior of Ceria Slurry with Anionic Surfactant on Abrasive Concentration and Size in Shallow Trench Isolation Chemical Mechanical Polishing
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5 |
[2006.04.__] To Build Efficient Relationship in e-Commerce by CRM
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4 |
[2006.04.__] Study on Development Direction of Construction Industry using RFID
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3 |
[2006.04.01] Effect of the Hydroxyl-Ethyl-Cellulose Concentration in a Silicon Wafer Polishing Slurry on the Wafer Surface Roughness
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2 |
[2006.03.__] Effect of Calcination Time on the Physical Properties of Synthesized Ceria Particles for the Shallow Trench Isolation Chemical Mechanical Planarization Process
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1 |
[2006.02.01] Atomic Force Microscopy Study of the Role of Molecular Weight of Poly(acrylic acid) in Chemical Mechanical Planarization for Shallow Trench Isolation
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