2011-2015 [2011.12.16] Influences of Organic Additive Molecular Weight in Colloidal-Silica-Based Slurry on Final Polishing Characteristics of Silicon Wafer
2021.03.06 13:54
Byeong-Sam Moon, Hee-Sub Hwang and Jea-Gun Park
Influences of Organic Additive Molecular Weight in Colloidal-Silica-Based Slurry on Final Polishing Characteristics of Silicon Wafer