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32 [2003.06.01] Crystal structures of two variants for CuPtb-type ordering in strained CdxZn1-xTe epilayers file
31 [2003.04.__] 고성능 나노 세리아 슬러리 개발  - 256메가 DRAM급 이상 초고집적 반도체 STI 연마 공정용
30 [2003.04.__] Dependence of crystal nature on the gettering efficiency of iron and nickel in a Czochralski silicon wafer file
29 [2003.03.15] Effects of the physical characteristics of cerium oxide on plasma-enhanced tetraethylorthosiliate removal rate of chemical mechanical polishing for shallow trench isolation file
28 [2003.03.15] Effects of abrasive morphology and surfactant concentration on polishing rate of ceria slurry file
27 [2003.02.20] Electron Mobility Behavior in Ultra Thin and Strained Si Inversion Layer Grown on SiGe-On-Insulator for 50nm MOS-FETs
26 [2002.10.__] Effect of crystallinity of ceria particles on the PETEOS removal rate in chemical mechanical polishing for shallow trench isolation
25 [2002.10.25] Polishing Condition Dependency of Nanotopography Impacts on Oxide Chemical Mechanical Polishing
24 [2002.10.25] Electronic parameter variations of the two-dimensional electron gas in modulation-doped nanoscale step quantum wells due to a nanosize embedded potential barrier
23 [2002.10.25] Effect of Slurry and Pad on Nanotopography Impact on Oxide CMP
22 [2002.10.25] Application of MPEG-4 Video to Standalone-based Unmanned Monitoring System
21 [2002.10.25] A Study of Interactive T-Commerce Service based on Data Broadcasting
20 [2002.07.24] New Spectral Analysis Method to Quantify Nanotopography Impact on CMP
19 [2002.07.11] The effect of agglomerated particle size on the chemical mechanical planarization for shallow trench isolation
18 [2002.07.01] The stability of nano fumed silica particles and its influence on chemical mechanical planarization for interlayer dielectrics file
17 [2002.07.01] Spectral Analysis Method for Nanotopography Impact on Pad and Removal Depth Dependency in Oxide CMP file
16 [2002.07.01] Nanotopography Effect of Improved Single-Side-Polished Wafer on Oxide CMP file
15 [2002.07.01] Abrasive and Surfactant Effects on Ceria Slurry for Chemical Mechanical Polishing in Shallow Trench Isolation
14 [2002.05.11] Characterization of surface and bulk defects for SOI wafer
13 [2002.04.15] The nanotopography effect of improved single-side-polished wafer on oxide chemical mechanical polishing file
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