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17 [2006.12.14] Influence of Wafer Property on Future Semiconductor Device : Crystal Nature, Gettering, Nanotopography and Strained Silicon
16 [2006.10.15] Strained Si Engineering for Nanoscale MOSFETs file
15 [2006.10.15] Extremely Proximity Gettering for Semiconductor Devices file
14 [2006.10.03] Post-RTA Effect on electrical characteristics of Nano-scale Strained Si Grown on SiGe-on-Insulator n-MOSFET file
13 [2006.09.__] Characterization of the High Luminance Top Emission Organic Light-emitting Devices (TEOLEDs) Using Dual Cathode layer file
12 [2006.09.07] Reduction of Large Particles in Ceria Slurry by Aging and Selective Sedimentation and its Effect on Shallow Trench Isolation Chemical Mechanical Planarization file
11 [2006.08.15] Monte Carlo study of surface roughness scattering in Si inversion Layer with improved matrix element file
10 [2006.07.03] Non-volatile Memory Fabricated with Al Nanocrystals Embedded in Conductive-Low-Molecular-Organic Layers
9 [2006.06.15] Organic Bi-Stable Device Fabricated with a Sandwich Structure of Al / AIDCN / Al Nano-Crystals Surrounded by Amorphous Al2O3 / AIDCN / Al file
8 [2006.06.08] Effect of Calcination Process on Synthesis of Ceria Particles, and Its Influence on Shallow Trench Isolation Chemical Mechanical Planarization Performance file
7 [2006.05.__] Dependence of Nanotopography Impact on Fumed Silica and Ceria Slurry Added with Surfactant for Shallow Trench Isolation Chemical Mechanical Polishing file
6 [2006.05.09] Dependence of Non-Prestonian Behavior of Ceria Slurry with Anionic Surfactant on Abrasive Concentration and Size in Shallow Trench Isolation Chemical Mechanical Polishing file
5 [2006.04.__] To Build Efficient Relationship in e-Commerce by CRM
4 [2006.04.__] Study on Development Direction of Construction Industry using RFID
3 [2006.04.01] Effect of the Hydroxyl-Ethyl-Cellulose Concentration in a Silicon Wafer Polishing Slurry on the Wafer Surface Roughness file
2 [2006.03.__] Effect of Calcination Time on the Physical Properties of Synthesized Ceria Particles for the Shallow Trench Isolation Chemical Mechanical Planarization Process file
1 [2006.02.01] Atomic Force Microscopy Study of the Role of Molecular Weight of Poly(acrylic acid) in Chemical Mechanical Planarization for Shallow Trench Isolation file