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Chae-Woong Cho, Sang-Kyun Kim, Ungyu Paik, Jea-Gun Park and W. M. Sigmund

 

Atomic Force Microscopy Study of the Role of Molecular Weight of Poly(acrylic acid) in Chemical Mechanical Planarization for Shallow Trench Isolation

 

J. Mater. Res. 21 (2006) 473

번호 제목
17 [2006.12.14] Influence of Wafer Property on Future Semiconductor Device : Crystal Nature, Gettering, Nanotopography and Strained Silicon
16 [2006.10.15] Strained Si Engineering for Nanoscale MOSFETs file
15 [2006.10.15] Extremely Proximity Gettering for Semiconductor Devices file
14 [2006.10.03] Post-RTA Effect on electrical characteristics of Nano-scale Strained Si Grown on SiGe-on-Insulator n-MOSFET file
13 [2006.09.__] Characterization of the High Luminance Top Emission Organic Light-emitting Devices (TEOLEDs) Using Dual Cathode layer file
12 [2006.09.07] Reduction of Large Particles in Ceria Slurry by Aging and Selective Sedimentation and its Effect on Shallow Trench Isolation Chemical Mechanical Planarization file
11 [2006.08.15] Monte Carlo study of surface roughness scattering in Si inversion Layer with improved matrix element file
10 [2006.07.03] Non-volatile Memory Fabricated with Al Nanocrystals Embedded in Conductive-Low-Molecular-Organic Layers
9 [2006.06.15] Organic Bi-Stable Device Fabricated with a Sandwich Structure of Al / AIDCN / Al Nano-Crystals Surrounded by Amorphous Al2O3 / AIDCN / Al file
8 [2006.06.08] Effect of Calcination Process on Synthesis of Ceria Particles, and Its Influence on Shallow Trench Isolation Chemical Mechanical Planarization Performance file
7 [2006.05.__] Dependence of Nanotopography Impact on Fumed Silica and Ceria Slurry Added with Surfactant for Shallow Trench Isolation Chemical Mechanical Polishing file
6 [2006.05.09] Dependence of Non-Prestonian Behavior of Ceria Slurry with Anionic Surfactant on Abrasive Concentration and Size in Shallow Trench Isolation Chemical Mechanical Polishing file
5 [2006.04.__] To Build Efficient Relationship in e-Commerce by CRM
4 [2006.04.__] Study on Development Direction of Construction Industry using RFID
3 [2006.04.01] Effect of the Hydroxyl-Ethyl-Cellulose Concentration in a Silicon Wafer Polishing Slurry on the Wafer Surface Roughness file
2 [2006.03.__] Effect of Calcination Time on the Physical Properties of Synthesized Ceria Particles for the Shallow Trench Isolation Chemical Mechanical Planarization Process file
» [2006.02.01] Atomic Force Microscopy Study of the Role of Molecular Weight of Poly(acrylic acid) in Chemical Mechanical Planarization for Shallow Trench Isolation file