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공지 Update 진행중
92 [2004.06.__] Characteristic Study for Defect of Top Si and Buried Oxide Layer on the Bonded SOI Wafer file
91 [2004.06.25] EUVL Mask Defect Isolation and Repair using Focused Ion Beam (Focused Ion Beam을 이용한 EUVL Mask Defect Isolation 및 Repair)
90 [2004.06.01] Nanotopography Impact in Shallow-Trench Isolation Chemical Mechanical Polishing - Analysis Method and Consumable Dependence file
89 [2004.05.28] EUV Lithography Blank Mask Repair using a FIB file
88 [2004.04.15] Effects of abrasive size and surfactant in nano ceria slurry for shallow trench isolation file
87 [2004.03.__] 초고집적 반도체 STI 연마 공정용세리아 슬러리의 특성이 나노토포그래피에 미치는 영향
86 [2004.03.01] Effects of Grain Size and Abrasive Size of Polycrystalline Nano-partical Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing file
85 [2004.03.01] Effect of the Nano Ceria Slurry Characteristics on end Point Detection Technology for STI CMP file
84 [2004.02.01] Nanotopography impact and non-prestonian Behavior of ceria slurry in shallow trench isolation chemical mechanical polishing (STI-CMP) file
83 [2004.01.15] Dependence of nanotopography impact on abrasive size and surfactant concentration in ceria slurry for shallow trench isolation chemical mechanical polishing file
82 [2003.12.31] Effect of the Abrasive and Additive Concentrations in Nano Ceria Slurry on CMP Pad Temperature
81 [2003.12.12] 나노 세리아 슬러리에 첨가된 연마입자와 첨가제의 농도가 CMP 연마판 온도에 미치는 영향 file
80 [2003.10.14] Effects of Abrasive Morphology and Surfactant in Nano-Ceria Slurry for Shallow Trench Isolation Chemical Mechanical Polishing
79 [2003.10.14] Effect of Slurry Characteristics on Nanotopography Impact in Chemical Mechanical Polishing
78 [2003.09.__] 나노 세리아 슬러리의 양산 공급 시스템