132 |
[2006.03.__] Effect of Calcination Time on the Physical Properties of Synthesized Ceria Particles for the Shallow Trench Isolation Chemical Mechanical Planarization Process
|
131 |
[2006.02.01] Atomic Force Microscopy Study of the Role of Molecular Weight of Poly(acrylic acid) in Chemical Mechanical Planarization for Shallow Trench Isolation
|
130 |
[2005.12.__] Comparison of phonon-limited electron mobility in strained Si grown on silicon on insulator (sSOI) and SiGe on insulator (SGOI)
|
129 |
[2005.12.08] The Effect of Cerium Precursor Agglomeration on the Synthesis of Ceria Particles and Its Influence on Shallow Trench Isolation Chemical Mechanical Polishing Performance
|
128 |
[2005.12.02] Investigation of multilayer structural changes in phase and amplitude-defects correction process
|
127 |
[2005.11.09] Agglomerated Large Particles under Various Slurry Preparation Conditions and Their Influence on Shallow Trench Isolation Chemical Mechanical Polishing
|
126 |
[2005.10.27] Development of Dynamic Interface for Sensor
|
125 |
[2005.10.15] Influences of pH and concentration of Surfactant on the Electrokinetic Behavior of a Nano-Ceria Slurry in shallow Trench Isolation Chemical Mechanical Polishing
|
124 |
[2005.09.10] Dependency of Phonon-limited Electron Mobility on Si Thickness in strained SGOI (Silicon Germanium on Insulator) n-MOSFET
|
123 |
[2005.09.01] 차세대 비휘발성 메모리 소자
|
122 |
[2005.09.01] PoRAM 최근 연구 동향 및 향후 개발 방향
|
121 |
[2005.07.08] Dependence of pH, Molecular Weight, and Concentration of Surfactant in Ceria Slurry on Saturated Nitride Removal Rate in Shallow Trench Isolation Chemical Mechanical Polishing
|
120 |
[2005.06.01] Cu-CMP에서 Alanine이 Cu와 TaN의 선택비에 미치는 영향
|
119 |
[2005.04.28] Design of Compact PIFA for Mobile Communication Handset
|
118 |
[2005.04.28] Automatic System and Productivity Elevation
|