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62 |
[2002.10.25] Electronic parameter variations of the two-dimensional electron gas in modulation-doped nanoscale step quantum wells due to a nanosize embedded potential barrier
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61 |
[2002.10.25] Effect of Slurry and Pad on Nanotopography Impact on Oxide CMP
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60 |
[2002.10.25] Application of MPEG-4 Video to Standalone-based Unmanned Monitoring System
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59 |
[2002.10.25] A Study of Interactive T-Commerce Service based on Data Broadcasting
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58 |
[2002.07.24] New Spectral Analysis Method to Quantify Nanotopography Impact on CMP
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57 |
[2002.07.11] The effect of agglomerated particle size on the chemical mechanical planarization for shallow trench isolation
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56 |
[2002.07.01] The stability of nano fumed silica particles and its influence on chemical mechanical planarization for interlayer dielectrics
 |
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55 |
[2002.07.01] Spectral Analysis Method for Nanotopography Impact on Pad and Removal Depth Dependency in Oxide CMP
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54 |
[2002.07.01] Nanotopography Effect of Improved Single-Side-Polished Wafer on Oxide CMP
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53 |
[2002.07.01] Abrasive and Surfactant Effects on Ceria Slurry for Chemical Mechanical Polishing in Shallow Trench Isolation
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52 |
[2002.05.11] Characterization of surface and bulk defects for SOI wafer
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51 |
[2002.04.15] The nanotopography effect of improved single-side-polished wafer on oxide chemical mechanical polishing
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50 |
[2002.01.15] Spectral analyses on pad dependency of nanotopography impact on oxide chemical mechanical polishing
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49 |
[2002.01.15] Effects of film type and nanotopography of wafers on oxide CMP characteristics
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48 |
[2001.12.18] The Effect of Si Dissolution on the Stability of Silica Particles and Its Influence on Chemical Mechanical Polishing for Interlayer Dielectrics
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