ASMDDC :: Papers

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[190524-25] 스승의 날 행사 @ 경기도 이천

[APR 24-26, 2019] SUMCO Workshop @ HYU (Seoul)

[JAN 08-11, 2019] CES 2019 "Eco-friendly QD UV Camera" @ Las Vegas, US

번호	제목
공지	Update 진행중
26	[1998.__.__] COP induced oxide breakdown decorated by Cu in CZ Si
25	[1998.__.__] Challenge of Material Properties for 300mm Wafers
24	[1998.09.28] Wafer Requirements : Memory Devices SEMI SILICON WAFER SYMPOSIUM
23	[1997.__.__] Effect of Crystal Defects on Device Characteristics
22	[1997.__.__] 300mm Wafer Technology
21	[1997.10.08] Ni/3C-SiC 계면의 Ohmic 특성
20	[1996.__.__] Effect of Crystal Characteristics on the DRAM Device Yield
19	[1996.__.__] DRAM Wafer Qualification Issues : Oxide integrity vs. D-Defects, Oxygen Precipitates and High Temperature Annealing
18	[1996.11.__] Wafer Engineering for DRAM Devices
17	[1996.11.25] Effect of Crystal Defects on Device Characteristics
16	[1995.__.__] Observation of Structural, Electrical, and Chemical Nature on Multi-ring Wafer
15	[1995.__.__] Nature of D-defect in CZ Silicon : D-defect Dissolution and D-Defect Related T.D.D.B
14	[1995.__.__] Gate Oxide Integrity in DRAM Devices : The Influence of Substrate D-defects
13	[1995.__.__] Effect of H2 Annealing on Oxide Integrity Improvement
12	[1995.__.__] Defect Oxide Defect Detection by Cu-decoration

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