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박재근 교수 연구팀, 초선형 임계 스위칭 특성의 신개념 시냅스 선택소자 개발...
국제 최상위 저명학술지 [Advanced Materials]에 게제 (IF: 32, 상위 2.15%)








[2022.07.15] 13th SUMCO Symposium @Hongcheon








[2022.05.15] 첨단 반도체 소재/소자 개발 연구소 스승의 날 행사
번호 제목
257 [2013.02.15] Dependence of Nickel Gettering on Crystalline Nature in As-grown Czochralski Silicon Wafer file
256 [2013.01.03] Corrosion Inhibitors in Sodium Periodate Slurry for Chemical Mechanical Planarization of Ruthenium Film file
255 [2012.12.01] Effect of MeV Nitrogen Ion Implantation on the Resistivity Transition in Czochralski Silicon Wafers file
254 [2012.11.27] Effect of Oxidizers on Chemical Mechanical Planarization of Ruthenium with Colloidal Silica Based Slurry file
253 [2012.11.14] Nonvolatile Hybrid Memory Cell Embedded with Ni Nanocrystals in Poly(3-hexylthiophene)   file
252 [2012.09.27] High polishing selectivity ceria slurry for formation of top electrode in spin-transfer torque magnetic random access memory file
251 [2012.09.21] Effect of Slurry pH and H2O2 on Polycrystalline Ge2Sb2Te5 CMP Performance file
250 [2012.08.01] Effect of a Thermally Evaporated Bis (2-methyl-8-quninolinato)-4-phenylphenolate Cathode Buffer Layer on the Performance of Polymer Photovoltaic Cells file
249 [2012.07.23] Polymer photovoltaic cell embedded with p-type single walled carbon nanotubes fabricated by spray process file
248 [2012.04.04] 실리콘 카바이드(SiC) CMP 슬러리의 연구 동향 file
247 [2012.01.26] Effect of Molecular Weight of Polyvinylpyrrolidone on Corrosion-Inhibition Efficiency of Polycrystalline Ge2Sb2Te5 Film file
246 [2012.01.18] Effect of Potassium Ferricyanide in the Acid Solution on Performance of Tungsten Chemical Mechanical Planarization file
245 [2012.01.13] Study of Ruthenium Oxides Species on Ruthenium Chemical Mechanical Planarization Using Periodate-Based Slurry file
244 [2011.12.21] Oxygen Ion Drift-Induced Complementary Resistive Switching in Homo TiOx/TiOy/TiOx and Hetero TiOx/TiON/TiOx Triple Multilayer Frameworks file
243 [2011.12.16] Influences of Organic Additive Molecular Weight in Colloidal-Silica-Based Slurry on Final Polishing Characteristics of Silicon Wafer file
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