2001-2005 [2005.01.28] Effect of dispersant addition during ceria abrasive milling process on light point defect (LPD) formation after shallow trench isolation chemical mechanical polishing (STI-CMP)
2019.06.26 15:38
Hyun-Goo Kang, Takeo Katoh, Dae-Hyung Kim, Ungyu Paik and Jea-Gun Park
Effect of dispersant addition during ceria abrasive milling process on light point defect (LPD) formation after shallow trench isolation chemical mechanical polishing (STI-CMP)