2016-2020 [2016.10.03] Development of Silicon Substrate for Advanced Multi-Chip Packaging Process with Enhanced Gettering Ability
2021.08.12 14:10
Development of Silicon Substrate for Advanced Multi-Chip Packaging Process with Enhanced Gettering Ability
Jeong-Hoon An, Jang-Seop Kim, Anselmo Jaehyeong Lee, Hyung-Kook Park, Hyeung-il Park, Byeong-Sam Moon, Sang-Hyun Lee and Jea-Gun Park